Lausanne, Switzerland-based Kandou, a high-speed, energy-efficient, chip link solutions company, announced that it has raised $75M (approx €66.57M) in its Series D round of funding.
With this, the company has now raised a total of $207.8M (approx €184.46M) in funding from new and existing investors to date. Investors in the company include Bessemer Venture Partners, DC Investment Partners, among others.