Arioso Systems GmbH, provider of a new disruptive micro transducer technology has secured €2.6M in its first financing round led by Brandenburg Kapital (Potsdam, Germany), a subsidiary of Brandenburger Förderbank ILB, and supported by High-Tech-Gründerfonds III (Bonn), Technologiegründerfonds Sachsen (Dresden) and business angels.
Based out of Dresden, Germany, Arioso Systems is developing and marketing a novel kind of an all-silicon micro-speaker chip that can reproduce audio sound with the highest fidelity.
Notably, the Arioso chip is designed to replace common electrodynamic loudspeakers in wireless in-ear headsets, the fastest-growing headphone, and wearables market.
The chip is based on what is known as the complementary-metal-oxide-semiconductor (CMOS) manufacturing process. In fact, CMOS technology accounts for more than 90% of the worldwide manufacturing capacity for micro-electro-mechanical systems (MEMS).
Arioso Systems’ all-silicon micro speakers feature a tiny form factor of only a few mm³, low weight, and high-power efficiency. These are the essential requirements for advanced hearables applications. Hearables are in-ear headsets, directly connected to the internet for perpetual access to multiple voice-controlled online services.
Dr. Hermann Schenk, leading managing director of Arioso Systems GmbH, commented:
“The market response to our technology is remarkable. Our all-silicon micro-speaker enables completely new design possibilities and has the potential of creating attractive new value chains. The industry has recognized this. Now it is crucial for Arioso to expedite market readiness.”
Arioso Systems is a spin-off from the Fraunhofer Institute for Photonic Microsystems IPMS in Dresden. Fraunhofer has granted Arioso Systems the exclusive license to commercialize the extensive IPMS patent portfolio for audio applications.
Dr. Jan Blochwitz-Nimoth, the co-managing director, amended:
“Now we can set up Arioso Systems with high speed to efficiently support our customers. We will match our new technology to the specific requirements of their future mobile audio devices.”
Main image credits: Arioso Systems
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